神武八荒一颗小说,辰东完美世界有声小说

振盛達(dá)電子科技

Z-startech Electronic

點(diǎn)擊了解更多>>

解決用膠難點(diǎn)

DA-4001FS(51)

DA膠

市場(chǎng)價(jià):￥0.00

價(jià)格:￥0.00

Product Description MATT DA-4051 is one component epoxy adhesive,which has high shear strength with image sensor die during high temperature bonding process such as hotbar or ACF bonding. It is designed to have high T.I and viscosity to prevent die rotation or tilt problem. Typical Application Bonding Adhesive Property of Uncured Material Color  Red Specific Gravity 1.35 Viscosity (Brookfield C&P HBDV-II, Spindle #51, 25°C)  5 RPM 14,000 cps Thixotropic Index 2.6 Work Life @ 25°C, days 3 Shelf Life @ -15°C, months 6 Physical Properties Gel time @ 100°C 22 S Hardness (Shore D) 80 Glass Transition Temperature (Tg) 42 °C Coefficient of Thermal Expansion Below Tg 47 ppm/°C Above Tg 170 ppm/°C Moisture absorption  0.71 % (100°C / 100%, 1 hr) Volume Cure Shrinkage 1.44 % Recommended Cure Condition 2 minutes @ 120°C (Hotplate) 30 minutes @ 85°C (Conventional Convection Oven)
AD-4051L

DA膠

市場(chǎng)價(jià):￥0.00

價(jià)格:￥0.00

Product Description MATT DA-4051L is a one component epoxy adhesive which has good moisture resistance. It is designed for bonding component providing excellent adhesion to various substrates. Typical Application Bonding Adhesive Property of Uncured Material Color                  Red Specific Gravity  1.36 Viscosity (Brookfield C&P HBDV-II, Spindle #51, 25°C) 5 RPM     8,000 cps Thixotropic Index  3.8 Work Life @ 25°C, days  3 Shelf Life @ -15°C, months  6 Physical Properties Gel time @ 100°C    34 S Hardness (Shore D)  78 Glass Transition Temperature (Tg)    32°C Coefficient of Thermal Expansion Below Tg      48ppm/°C Above Tg     209ppm/°C Moisture absorption   0.82% (100°C / 100%, 1 hr) Volume Cure Shrinkage   0.79% Recommended Cure Condition 2 minutes @ 120°C (Hotplate)
AD-4001FS

DA膠

市場(chǎng)價(jià):￥0.00

價(jià)格:￥0.00

Product Description MATT DA-4001FS is one component epoxy adhesive, which has high shear strength with image sensor die during high temperature bonding process such as hotbar or ACF bonding. It is designed to have high T.I and viscosity to prevent die rotation or tilt problem. Typical Application Die Attach Adhesive Property of Material Color   Pink Specific Gravity   1.50 Viscosity (Brookfield C&P HBDV-II, Spindle #51, 25°C) 5 RPM  20,000 cps Thixotropic Index  3.3 Work Life @ 25°C, days 1 Shelf Life @ -15°C, months  6 Physical Properties Gel Time @ 150°C, Hot plate  9S Hardness (Shore D)   83 Glass Transition Temperature (Tg)  55 °C Coefficient of Thermal Expansion Below Tg  71 ppm/°C Above Tg 143 ppm/°C Moisture Absorption  0.75 % (100°C / 100%, 1hr) Volume Cure Shrinkage  0.61 % Die Shear Adhesion    Si die (3mm x 3mm) to FR4 PCB @ 25°C     37 kgf @ 230°C   3.2 kgf

< 1 >

粵ICP備19132769號(hào)

FOLLOW US

關(guān)注我們